Dr. Yun Zhang

R&D and Technical Marketing Director for wafer plating at Enthone Inc.

Dr. Yun Zhang received her PhD degree in Inorganic and Electrochemistry from Brown University in 1991. After postdoctoral work at Purdue University and Brookhaven National lab concentrating on surface electrochemistry, she joined AT&T Bell Labs in 1994 to work on electroplating. She has been working in electroplating and related surface and materials science since, and had held positions of MTS and R&D manager. She joined Enthone Inc., a Cookson Electronics company in 2002, and is currently R&D and Technical Marketing Director for wafer plating.

Abstract: Bath Chemistry for Through-Silicon-Via Plating

One of the challenges for 3D integration utilizing electroplated Cu vias is the cost of via fill. There are several factors contributing to the cost, namely, fill defects, overburden, fill time, and bath life. Enthone has been successful in addressing the first three aspects in the last two years, and is working with tool partners and selected customers to access bath life in a manufacturing environment. In this presentation, we shall discuss the importance of reliable bath constituents’ analysis, bath maintenance, and process control.