Technology Roadshow for 3D Integration and Packaging

3D integration of microelectronic devices is fueling the race to develop future electronic products

SUSS MicroTec, Surface Technology Systems (STS), NEXX Systems and our seminar guests are at the forefront of developing equipment and process solutions for these exciting technologies.

This roadshow will provide a comprehensive overview of new developments in the field of Through-Silicon-Via (TSV) etching and filling, high aspect-ratio Lithography, temporary bonding and materials associated with these technologies. Speakers from leading-edge corporations and institutes will provide a user’s point of view on critical topics for this revolutionary technology.

The seminars are technical in nature and should be attended by R&D and production managers, process engineers and all that are interested in the technical aspects of these groundbreaking technologies.

Join us for this important technology symposium to learn how big results can be achieved with small dimensions.

Locations

  1. Durham, NC - May 12th, 2008 Durham Doubletree[Agenda and Speakers]
  2. Dallas, TX - May 14th, 2008 Dallas Embassy Suites Galleria[Agenda and Speakers]
  3. San Jose, CA - May 15th, 2008 Doubletree at SJC airport[Agenda and Speakers]

The seminars will be held from 10:00AM – 5:00PM. Lunch and refreshments will be provided.

Please register here. We look forward to seeing you there.