Robert Lanzone

VP Advanced Product Development – Amkor Technology Inc.

Robert (Bob) Lanzone has been in the electronics industry for over 20 years working in diverse and progressive roles in advanced packaging development, technology, manufacturing, marketing, and business development. He has worked for Industry Leaders in their respective fields or market segments such as IBM, Kyocera, Unitive, ChipPAC and currently Amkor as the VP of Advanced Packaging Development. His current focus is on 3D packaging integration including TSV, System in Package and Fine Pitch Flip Chip.

Through his years of experience, Bob has worked with many leading suppliers / customers in the supply chain from Fabless, Integrated Device Manufactures, Foundry, SATS, and EMS providers.

His technical background spans the following advanced packaging arenas such as: Flip Chip, Wafer Level Packaging, High & Low Temperature Co-fired Ceramics, High Density Build Up Organics, Ball Grid Array, 3-D, Stacked, Chip Scale Packaging, and Surface Mount Technology. He has authored a number of papers on these subjects and has presented at numerous Technology Conferences and Symposiums.