Robert Forman

Sales Manager for Semiconductor Advanced Packaging, Rohm and Haas Electronic Materials L.L.C.

Robert Forman is the Sales Manager for Semiconductor Advanced Packaging, Rohm and Haas Electronic Materials L.L.C., Packaging and Finishing Technologies. He received his BS in Chemistry from the University of Oregon in 1975 and began his career in the electronics industry at Tektronix in 1977. He has been involved in electronic materials engineering and manufacturing for the past eight years with Rohm and Haas Company. Bob has held a variety of positions in technical and sales management. His current role is in the development and promotion of materials that address the needs of wafer level packaging.

Abstract: New Materials for 3D integration

Bob Forman, Rohm and Haas Electronic Materials will be demonstrating processes and materials used in the construction of a Chip scale package CMOS image sensor that has low cost and uses low temperature processes in manufacture (<200C). Included in the discussion are demonstrations of new types of dielectrics, photoresist, TSV copper plating chemistry and advances in copper etching chemistry.

Hosted by