Dr. Paul Enquist

CTO / Vice President of R&D at Ziptronix, Inc.

Dr. Enquist is a founder and the CTO / Vice President of R&D at Ziptronix, Inc. Prior to joining Ziptronix, Dr. Enquist spent nearly 15 years with RTI International where he led a research team developing high performance heterojunction bipolar transistor (HBT) materials, devices, and circuits. He has authored more than 60 publications and presentations and has over 20 issued US Patents. Dr. Enquist holds a Ph.D. and a Master of Science degree in Electrical Engineering from Cornell University.and Bachelor of Science degree in Engineering from Columbia University. He is an IEEE Senior Member and member of Tau Beta Pi and Eta Kappa Nu.

Abstract: Direct Bond Interconnect for 3D Devices

This talk will describe the Ziptronix direct oxide bond process technology and its suitability for the fabrication of three dimensional integrated circuits (3-D ICs). In particular, the capability of Direct Bond Interconnect (DBI®) as a low cost, manufacturable, direct oxide bond technology that creates a very fine pitch 3D electrical interconnect network is described with regard to building scaleable 3-D ICs. Advantages of the technology including foundry back-end-of-line synergy, high throughput wafer-to-wafer and die-to-wafer implementation, low capital expenditure, low thermal budget, yield and reliability will be presented.

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