Surface Technology Systems plc

Surface Technology Systems plc is a leading manufacturer of plasma etch and deposition equipment for MEMS, Advanced Packaging, optoelectronics, Compound Semiconductors and Data Storage applications. STS will present the latest developments in deep reactive ion etching (DRIE) for silicon micromachining, with details about recent improvements to equipment hardware and processing capabilities. www.stsystems.com

SUSS MicroTec

SUSS MicroTec is a global supplier of semiconductor processing and test equipment for MEMS, Advanced Packaging, Nanotechnology, SOI and emerging markets. SUSS will present technical papers on advances in MEMS and 3-D technology including state-of-the-art wafer bonding, lithography solutions for thick resist applications and spray coating, precision assembly using flip chip bonding and custom test solutions for MEMS sensors. www.suss.com

NEXX Systems

NEXX Systems brings exceptional technical expertise to flip chip and advanced packaging. Our product lines provide the most efficient, yet affordable, systems of their kind: Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. www.nexxsystems.com