Georg Pawlowski

Global R&D Manager – Thick Film Photoresists
AZ Electronic Materials

Georg Pawlowski received his PhD in Organic Chemistry from the University of Tuebingen/Germany in 1981. Since then he has been working on the development of radiation sensitive materials at Hoechst AG and her legal successors, Clariant Corporation and AZ Electronic Materials Corporation, in various technical and managerial R&D positions in Germany, Japan, and the US. Since 2001, he has worked with AZ Electronics Materials in Branchburg/NJ, most recently as the Global R&D Manager for Thick Film products. Georg holds approximately 75 patents on radiation sensitive materials and has co-authored a similar number of technical papers and monographies in this area.

Abstract: Thick Chemically-Amplified Photoresists for 3D TSV’s and Plating

Advanced 3-D packaging schemes are rapidly emerging worldwide as they are expected to provide device solutions, such as higher speed, smaller dimensions, and multifunctionality as demanded by an increasingly mobile society. While conventional photoresist materials can meet many of the requirements posed by these new technologies, resist manufacturers work on improved materials to facilitate more cost effective solutions.

This presentation focuses on new negative resists, which provide numerous advantages for the manufacturer. A short discussion of the benefits using negative materials for 3D-packaging is followed by a detailed description of the resist options including their basic design, benefits, and limitations. Finally, selected results of some recently developed materials will be presented.