Chris Milasincic

Global New Business Development Manager, HD Microsystems

CHRIS MILASINCIC is the Global New Business Development Manager for HD Microsystems, a jointly owned company held by Dupont and Hitachi Chemicals specializing in liquid polyimide solutions for semiconductor fabrication. Chris joined DuPont in 1990 and has worked in HDM since 2006. He is assigned to develop new business applications for liquid polyimides including wafer and chip scale bonding applications for 3D-Integration and new flexible displays polyimide substrate materials.

Chris holds a B.S. degree in Chemical Engineering and a J.D. in Law specializing in Intellecutal Property. He is a holder of 4 U.S. pending patents and worked as a patent attorney, in addition to other related assignments, in polyimides for more than 10 years.

Abstract: Material Solutions for 3D and TSV’s

Through Silicon Via (TSV) technology and 3D Integration have gained much attention as a general design solution to meet the needs for higher device performance and lower cost of ownership. Polyimides have been used successfully in semiconductor fabrication as stress buffer layers, passivation layers for wafer-scale packaging and packaging redistribution layers. Today, thermoplastic polyimide adhesives are being used in applications for wafer/chip bonding providing thermal resistance beyond 350C, good chemical resistance to solvents, etchants and soldering materials, as well as resistance to unwanted metal migration. Polyimides provide good dielectric strength exceeding 250V/um. Photosensitive polyimide adhesives are also available.

Another major challenge implementing 3D packaging is the formation of high aspect ratio TSV interconnects having low cost and sufficient via uniformity and density. DuPont's dry-film photoresist materials and new process technology can meet these requirements including via diameter as low as 7um, with uniform shape and geometry across 300 mm wafers. DuPont's dry films offer resist thickness uniformity (+/- 2%) in a one step coating, and are tailored for high DRIE etch selectivity (>100:1) as well as minimal impact on electrolytes for clean uniform plating. Results also show advantages for TSV processing regarding cleanliness and via protection. The unique "tenting capability" of dry film prevents resist residues inside the via, and allows the resist to to protect via integrity in subsequent plating or etching processes.