Robert S. Patti

Chief Technology Officer
Tezzaron Semiconductor

Bob Patti attended Rose-Hulman Institute of Technology, earning bachelor of Science degrees in both physics and electrical engineering. He founded an R&D company specializing in high-performance systems and ASICs and participated in the design of over 100 chips in the course of 12 years. Tezzaron Semiconductor grew from that company to become a leading force in 3D-IC technology. Today Bob serves as CTO of Tezzaron, using wafer-level stacking processes to create ultra high-density 3D memory products and other semiconductor sub-components.

Abstract: Development of 3D High-Performance Memory

Memory is one of the first “killer” applications for 3D semiconductors, bringing great new opportunities and challenging new issues. Innovative architectures and process separation are critical keys to effective 3D memories. Designing in 3D greatly improves stand-alone memory devices, but even more benefits arise with 3D intimate attachment of memory to logic devices. Exponentiating bandwidth requirements are outstripping the limits of circuit board technology; 3D is the best and most available alternative. Power savings, size reduction, and ten-fold performance improvements are realistic goals.