Aldo Orsi

Global Product Manager – Thick Film Photoresists
AZ Electronic Materials

Aldo Orsi graduated in 1983 from Santa Clara University with a Bachelor of Science in Engineering Physics. He started his 25 year career in the IC industry as a masking engineering at Signetics Corporation (Philips) and then became a Lithography Engineer in their manufacturing operations in Albuquerque, NM. Aldo then moved into the world of specialty chemicals/photoresists, where he has held various roles, including Technical Sales and Applications, Sales Team Leader, and Global Account Manager. He joined AZ Electronic Materials in 1999 as the West Region Sales and Applications Manager, and moved into his current role as Global Product Manager in 2006. In this role, Aldo is focusing his efforts on the development, introduction, and promotion of enabling and cost-effective, advanced thick film photoresists to address the challenging advanced packaging requirements facing the industry today.

Abstract: Thick Chemically-Amplified Photoresists for 3D TSV’s and Plating

Advanced 3-D packaging schemes are rapidly emerging worldwide as they are expected to provide device solutions, such as higher speed, smaller dimensions, and multifunctionality as demanded by an increasingly mobile society. While conventional photoresist materials can meet many of the requirements posed by these new technologies, resist manufacturers work on improved materials to facilitate more cost effective solutions.

This presentation focuses on new negative resists, which provide numerous advantages for the manufacturer. A short discussion of the benefits using negative materials for 3D-packaging is followed by a detailed description of the resist options including their basic design, benefits, and limitations. Finally, selected results of some recently developed materials will be presented.