Alan Huffman

Research Engineer with RTI’s Center for Materials and Electronic Technologies

Alan Huffman is a Research Engineer with RTI’s Center for Materials and Electronic Technologies. He received a B.S. degree in physics from UNC-Chapel Hill in 1994 and subsequently joined the Microelectronics Center of North Carolina. At MCNC his work focused on the development flip chip fabrication and assembly processes, specifically the development of flip chip technologies enabling high density area array connections for 50 micron pitch devices. He joined RTI in 2005 after RTI acquired the research divisions of MCNC. His work currently focuses on the development of interconnect solutions for 3D integration, application of fine pitch flip chip in pixelated imaging and detector devices, and packaging for large area, high power IR emitter devices.

Abstract: 3D Integration Technology Platform at RTI

For over 7 years, RTI International has been developing and implementing a broad range of 3D integration technologies. Working with our government, academic, and commercial partners, these technologies are now enabling a number of cutting-edge imaging and detector applications. Our technology platform not only provides the basic building block processes for 3D integration, such as TSV formation and bonding processes, but also encompasses design, supporting back-end of line processes, and analysis capabilities. This presentation will focus on a number of RTI's process capabilities and describe the applications they have enabled with our collaborators.